JIS Z 0602 PDF

JIS Z Test methods for flat pallets (FOREIGN STANDARD). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. Standard (JIS Z ) was performed. From the obtained results, the possibility of practical application was exam- ined. Moreover, the manufacturing process of. JIS Z – JIS Z Test methods for flat pallets. Publication date: ; Original language: English. Please select.

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Shape palameter 2 Refer to Figure B. A typical example x this is the movement of molecules of a classical, ideal gas. Math Statistics And Probability A. Since iis location of the dust particles on the wafer surface is unpredictable, we can assume that mask defects occur completely at r random. The lot is acccepted when failures are grater than Ac but less then Re.

As time t passes, the failure rate of these semiconductor devices changes.

This is known as consumer’s risk. Such a probability is a typical example of the binomial probability distribution. His otherwise specified, use Inspection Standard II. Expected characteristics of the function fNorm x are these: For example, if we say that a given semiconductor device has a failure rate of 10 FIT, this means that one device fails for every component hours.

JIS Z – Test methods for flat pallets (FOREIGN STANDARD)

After n times of tests, any one of the results is E1, E2, The higher the temperature of the molecules, the higher becomes their energies, and so increasing the temperature quickens reactions. Variance of normal distribution X0: Number of pieces rejected.


We will not discuss the correctness of this in a strict mathematical sense. IX Thus understanding the Poisson distribution in different ways we can clarify its relations with other probability distributions. To serve as an example, 002 the life L in equation IX For studying the change, in this model, probabilities of individual devices failing by the time t are uniformly p tand the probability that at least one of the n devices will fail is F t. From one end of the wafer, each portion is inspected with a microscope.

Let us assume that the device will fail when the characteristic value changes to XL. Such a phenomenon occurs with some probability. It is represented by a straight line according to the relation expressed by equation IX Each test result is independent from one another. This will be illustrated later in section C, “Relations of Probability Distributions. Documents Flashcards Grammar checker. It 06022 important to note that N no longer denotes the number of tests of Bernoulli trial due to the approximation of the binomial probability distribution to the Poisson distribution.

This is because the denominator of the defining expression equation IX component hours does not refer to any particular device.

We cannot expect that there will be no collision for some time since one has just occurred. The average probability of finding a mask defect within the area C approaches the probability that a mask defect exists on a point on the jsi of the wafer. As the device is subjected to more and more cycles of intermittent operation nas shown in figure B. The Japan society of machinery water vapor tables new edition Note: Also, the probability that a device will not fail before time ti is the reliability function R ti.


The Gamma distribution is a failure probability density function if failure occurrence is considered to follow the Poisson process. In general, once a semiconductor device has failed, it cannot be repaired and used again.

The probability that a device will fail before the time ti is known as the failure or non-reliability distribution function f ti. This is explained as follows. 06602

JIS Z 0602:1988

Moreover, we consider the system in figure B. The parameter is the value of m. This probability is expressed as follows using equation IX for the Poisson distribution. How the lot acceptance rate changes is illustrated by the operation characteristic curve OC curve in figure B.

Scale palameter Refer to Figure B. Regular versus Military Time.

Wear-outfailures which almost suddenly outbreak after a certain period approximate the normal distribution. The double exponential distribution is suitable for analysis of such kinds of phenomena. This is known as the multinomial distribution.

If the operating time between subsequent failures of a device throughout its life until discarded is given by t1, t2, We deal with this issue in B. Hence, results fall into m classes E1, E2, Displacement mm [single jus v: This is based on equation IX This probability is described by the binomial probability distribution fBin x, n, p.