Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.
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This can be determined by weighing a representative quantity of material known to be at equilibrium with the manufacturing environment, baking to a iipc constant weight, and subtracting the? Any standard involving a complex technology draws material from a vast number of sources.
This will reset the? Storage of SMD packages in a dry cabinet should be limited to a maximum time per Table Floor-life derating j-atd-033b.1 discussed in Clause 7. Individuals or companies are invited to submit comments to IPC.
Testing Procedure Place the sealed container of cards into the chamber. For the purpose of ipd standard, SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials. The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount re?
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Water clean processes after the? Refer to Figure A Although the body temperature during re? The temperature and time for baking SMD packages are therefore limited by solderability considerations. J-std033b.1 cards may be available from the HIC manufacturer if needed to con?
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Although unanticipated, factors other than moisture sensitivity could affect the total shelf life of components. An equivalency evaluation is recommended to ensure that high temperature processing maintains moisture -jstd-033b.1 gain to an acceptable level. An example HIC is shown in Figure If the bags are opened under factory ambient conditions, see Clause 4.
If one hour exposure is exceeded, refer to Clause 4.
After bake, must be re? With component and board temperature restrictions in mind, choose a bake temperature from Table ; then determine the appropriate bake duration based on the component to be removed.
Other suggestions for document improvement: These methods are provided to avoid damage from moisture absorption and exposure to solder re? The caution label shall be j-str-033b.1 to the MBB if used or to the lowest-level shipping container. Paper and Plastic Container Items The cards inside the chamber must be observable from outside the chamber.
Other color schemes may be used. Allow the cards to condition for a minimum of 24 hours.
This value should to be obtained from the desiccant manufacturer. While the principal members of the Joint Moisture Classi? The percentage of change in hue from one humidity value to another is then calculated. Impose following two exposure conditions: Humidity conditions can be achieved by placing combinations of molecular j-std-033g.1 desiccant, glycerin, and water inside the chamber.
If the actual shelf life has exceeded 12 months, but less than 2 years, from the bag seal date and the humidity indicator card HIC see Clause 5. If dried and sealed in an MBB with fresh desiccant, the shelf life is reset. Marty Rodriguez, Jabil Circuit, Inc.