J-STD-002C PDF

12 Feb IPC/EIA/JEDEC J-STDB. Solderability Tests for Component Leads,. Terminations, Lugs,. Terminals and Wires. A joint standard developed. This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads. ANSI/IPC J-STDC Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November ) [IPC] on.

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Solid State Memories JC JESD 7 Feb This fixturing further defines the environment for thermal test of packaged microelectronic devices.

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This revision now covers components to be processed at higher temperatures for lead-free assembly. If package warpage or coplanarity is to be characterized at reflow soldering temperatures, then JESDB should be used. This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations.

The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. Current search Search found 32 items. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.

This will have a positive effect on quality and reliability as users gain more access to proper methods in designing, producing, and testing parts. These tests are used frequently in qualifying integrated circuits as a newproduct, a product family, or as products in a process which is being changed. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. Reaffirmed June JESDBB Sep The purpose of this test is to measure the deviation of the terminals leads or solder balls from coplanarity at room temperature for surface-mount semiconductor devices.

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Transistors 2 Apply JC This fixturing further defines the environment for thermal test of packaged microelectronic devices.

The purpose of this test is to measure the deviation of the terminals leads or solder balls from coplanarity at room temperature for surface-mount semiconductor devices.

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard also applies to 2nd level terminal materials for bumped die that are used for direct board attach. This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

This publication describes guidelines for applying JEDEC reliability tests and recommended testing procedures to integrated circuits that require adapter test boards for electrical andreliability testing. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead Pb containing or Pb-free solder for the attachment.

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Filter by document type: This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level requirements.

Mechanical Standardization filter JC Show 5 10 20 results per page. This is intended to facilitate access to the applicable documents when working with electronic hardware. This document identifies the classification level of nonhermetic solid-state surface mount devices SMDs that are sensitive to moisture-induced stress.

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Displaying 1 – 20 of 32 documents. Multiple Chip Packages JC This j-std-002cc describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit.

These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Mechanical Standardization 2 Apply JC J-STD is now on revision D. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.

It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods j-sstd-002c test environments.

Search by Keyword or Document Number. JESDBE Oct This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. This test method, may be used by users to determine what classification level should be used for initial board level reliability qualification.